以铜片为基板，采用两步电镀法制备出具有超疏水和疏水特性的微纳结构A、B 2个表面，与常规铜表面一并应用于低液位过冷池沸腾，过冷度分别保持在0、20℃和40℃。实验结果表明，与饱和沸腾不同，液位降低并未明显提高沸腾传热系数，3个表面的传热系数在40℃过冷度情况下还出现了降低的情况。主要原因是过冷情况下液位降低虽然会形成超大气泡，在高功率时抑制气泡脱离或在低功率时增加气泡扰动，同时导致流体的温度梯度减小、单相对流换热效果减弱，致使沸腾传热系数降低。受超疏水润湿性和较大汽化核心密度的影响，液位降低时A表面饱和沸腾传热系数提升效果最佳，过冷沸腾传热系数也未严重恶化。

By using copper sheet as substrate,a two-step electrodeposition method is applied to fabricate two micro/nano-structured copper surfaces (A and B) with super-hydrophobic and hydrophobic features,respectively.These two surfaces and a conventional copper surface are applied in subcooled pool boiling at low liquid level.Subcooling degrees remain at 0℃,20℃and 40℃,respectively.Experimental results show that heat transfer coefficients of subcooled boiling in shallow water for the surfaces do not increase with the dropping liquid level,which is different from saturated boiling in shallow water.On the contrary,heat transfer coefficients of three surfaces all deteriorated due to dropped liquid level when the subcooled degree is at 40℃.Reducing liquid level can result in the decreasing single phase convection by reducing the temperature gradient,although super big bubble will form when the liquid level dropped enough,which can depress bubble departure frequency and enhance bubble turbulence.Due to its super-hydrophobicity and larger nucleation site density,surface A performs the best among these three surfaces.