现代化工

现代化工 ›› 2017, Vol. 37 ›› Issue (7) : 45-48,50. DOI: 10.16606/j.cnki.issn0253-4320.2017.07.011

技术进展

高导热AlN陶瓷基片制备技术研究现状及发展趋势

倪红军, 倪威, 马立斌, 何竟宇, 顾涛, 吕帅帅

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Research status and development trend of preparation technologies for high thermal conductivity AlN ceramic substrates

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摘要

主要对高导热AlN陶瓷基片的粉体制备、成型工艺、烧结工艺等方面的关键技术进行了简单介绍，并指出在发展过程中遇到的一些问题，最后对高导热AlN陶瓷基片关键技术进行总结与展望。

Abstract

This paper mainly introduces the key technologies of powder preparation,molding process and sintering process of high thermal conductivity aluminum nitride (AIN) ceramic substrate.Some problems encountered in the development process are pointed out.Finally,summary and prospect of the key technologies of AIN ceramic substrate are given.