PDF (3533K)
摘要
综述了石墨烯在导热硅凝胶领域的应用及研究进展,介绍了石墨烯复合硅凝胶的导热机理,分析总结了石墨烯的尺寸及层数、填充量、共价键改性、非共价键修饰以及结构设计对石墨烯基导热硅凝胶的影响,展望了石墨烯基导热硅凝胶的应用前景,并为下一步的研究开发提供思路。
Abstract
The application and research progress of graphene in the field of thermal conductive silica gel are reviewed.The heat conducting mechanism of graphene compounded silica gel is introduced.In addition,the impacts of the size,layer number,filling amount,covalent bond modification,non-covalent bond modification and structural design of graphene on graphene compounded thermal conductive silica gel filled are analyzed and summarized.Finally,the application prospect of graphene filled thermal conductive silica gel is predicted,and the ideas for the research and development in the future are provided.
关键词
石墨烯
/
复合材料
/
导热通路
/
导热系数
/
导热硅凝胶
Key words
graphene
/
composite material
/
heat conduction path
/
thermal conductivity
/
thermal conductive silica gel
Author summay
文芳(1990-),女,硕士,工程师,研究方向为石墨烯导热界面材料的检测;王良旺(1990-),男,博士,高级工程师,研究方向为石墨烯功能材料的检测,通讯联系人,wanglw1990@163.com。
石墨烯填充导热硅凝胶的研究进展[J].
, 2024, 44(7): 46-50,56 DOI:10.16606/j.cnki.issn0253-4320.2024.07.009
