两亲性嵌段共聚物PCL₁₀₅-b-PEO₁₁₄自组装形成胶束的同时包封金纳米粒（AuNPs）制得PCL₁₀₅-b-PEO₁₁₄@Au胶束。通过动态光散射测定PCL₁₀₅-b-PEO₁₁₄@Au的粒径，通过透射电镜（TEM）观察胶束形貌并测定纳米粒包封率和载金率。研究本体法与微流控芯片法制得的PCL₁₀₅-b-PEO₁₁₄@Au的粒径、包封率和载金率，并考察在不同流速下曲线型和直线型微流控芯片制得胶束的粒径、包封率和载金率。结果表明，微流控芯片制得胶束的包金效果优于本体法，且相同流速下，曲线型微流控芯片上运行得到的PCL₁₀₅-b-PEO₁₁₄@Au胶束的包金效果好于直线型芯片。当AuNPs与PCL₁₀₅-b-PEO₁₁₄的摩尔比为1∶0.5时，以400 μL/min的流速在曲线型微流控芯片上制得的PCL₁₀₅-b-PEO₁₁₄@Au纳米粒的包封率为76.3%，载金率为110.8%。

Poly(ε-caprolactone)-b-poly(ethylene oxide) (PCL₁₀₅-b-PEO₁₁₄), an amphiphilic diblock copolymer, is self-assembled to form micelles to prepare PCL105-b-PEO114@Au micelles. The samples' size is measured by dynamic light scattering (DLS), and their morphology, encapsulation efficiencies and gold-loading rates are studied by transmission electron microscope (TEM). The size, encapsulation efficiency and gold-loading rate of the micelles prepared via bulk method and microfluidic chip method, respectively are studied. The size, encapsulation efficiency and gold-loading rate of the micelles prepared via microfluidic chip method at different flow rate on curved and linear microfluidic chips are studied respectively. The results show that the micelles prepared by microfluidic chip method show higher encapsulation efficiency and gold-loading rate than that prepared by bulk method. The encapsulation efficiency of the micelles prepared on curved chip is better than that prepared by straight chip under the same flow rate. As the molar ratio of AuNPs and PCL₁₀₅-b-PEO₁₁₄ is 1∶0.5, the encapsulation efficiency and gold-loading rate of the micelles prepared on a curved microfluidic chip at a flow rate of 400 μL·min^-1 are 76.3% and 110.8%, respectively.

门吉英(1981-),女,博士,副教授,研究方向为纳米靶向释药系统的构建,menjiying@nuc.edu.cn