以铜片为基底，通过变电位沉积方法制备了CoP和CoCuP电极。在1 mol/L KOH中，CoCuP催化水氧化电流达到10 mA/cm²所需的过电势为238 mV，明显优于CoP催化剂。结果表明，铜掺杂能够调节电极表面形貌，CoCuP形成独特的纳米片层堆积结构，具有更高的电活性面积。此外，铜掺杂还能调节催化活性位点，CoCuP相对于RHE表现出pH依赖的OER活性，表明晶格氧作为催化活性位点参与了OER反应，进而提高了催化剂的OER活性。

CoP and CoCuP electrodes are prepared through potentiodynamic deposition method with copper foil as substrates.CoCuP electrode exhibits an excellent activity toward oxidation of water in 1 M KOH with an overpotential of only 238 mV at a current density of 10 mA·cm^-2,which is significantly better than CoP electrode.Systematic research shows that Cu doping into Co-P can adjust the surface morphology of the electrode.CoCuP forms a unique nano-sheet stacking structure with a higher electrochemically active surface area compared with CoP.In addition,CoCuP exhibits pH-dependent OER activity relative to RHE,indicating that the lattice oxygens participate in the OER reaction as active sites,which enhances the OER activity of the catalyst.

陈俊池(1995-),女,硕士研究生,研究方向为电催化水氧化材料,chenjunchi@mail.dlut.edu.cn