对本征型自修复进行了详细介绍，具体阐述了利用酰腙键、二硫键、Diels-Alder反应等可逆共价键以及氢键、疏水、静电和金属配体作用等可逆非共价键来制备自修复材料的修复机理和研究现状，最后阐述了本征型自修复材料目前存在的问题，以及未来的发展目标和方向。

This paper introduces mainly intrinsic self-healing,and describes specifically the healing mechanism and research status of self-healing materials that are manufactured by means of reversible covalent bonds such as acylhydrazone bond,disulfide bond and Diels-Alde reaction,as well reversible non-covalent bonds such as hydrogen bonding,hydrophobic interaction,electrostatic interaction and metal ligand interaction.Finally,the existing problems of intrinsic self-healing materials are pointed out and future directions are prospected.

范泽文(1996-),男,硕士生