以SiO₂为壳材，相变材料石蜡（PA）为芯材，采用界面水解缩聚法制备石蜡相变微胶囊（PA@SiO₂）。FT-IR和SEM测试结果表明，制备的石蜡相变微胶囊具有球形颗粒外观，且制备过程中除了正硅酸四乙酯（TEOS）的水解缩聚，没有发生其他化学反应；DSC及TGA对样品进行热性能测试，得出该微胶囊熔融温度和熔融热焓分别为53.64℃和67.19 kJ/kg，其热效率可达44.83%，且SiO₂的包覆提高了相变材料的热稳定性。此外，利用红外热成像仪观察石蜡与相变微胶囊的升降温过程发现，经无机壳材SiO₂包覆后，材料的升降温速率较石蜡相变材料明显提高，且微胶囊化对固-液相变材料具有很好的定形效果。制备的相变微胶囊具有较高的相变潜热，可在能量存储、蓄热调温及军事伪装等方面得到应用。

Phase change microencapsule (PA@SiO₂) is fabricated by means of interfacial hydrolysis and polycondensation methods with SiO₂ as shell material and phase change material paraffin (PA) as core material.Results by Fourier transform infrared spectroscopy (FT-IR) and scanning electron microscopy (SEM) show that the prepared phase change microencapsule (PCMs) has a spherical appearance and there are no other chemical reactions occurred in the preparation process besides of hydrolysis and polycondensation of TEOS.It is found through differential scanning calorimetry (DSC) and thermogravimetric analyzer (TGA) that the melting temperature and enthalpy of the microencapsule are 53.64℃ and 67.19 kJ·kg^-1,respectively.TGA curves indicate that the encapsulation with SiO₂ improves the thermal stability of the phase change material.In addition,an infrared thermal imager is employed to observe the thermal conductivity of paraffin and microencapsules.Results demonstrate that the heating/cooling rates of the materials encapsulated with the inorganic shell SiO₂ are significantly higher than that of paraffin phase change material.Moreover,microencapsulation has a good shaping effect on the solid-liquid PCMs.The prepared PA@SiO₂ has a high latent heat and can be applied in various fields such as energy storage,temperature regulation,military camouflage and so on.

吴越(1998-),女,本科生,主要研究方向为热能存储材料,18352486508@163.com