Research status and development trend of preparation technologies for high thermal conductivity AlN ceramic substrates
NI Hong-jun1, NI Wei1, MA Li-bin2, HE Jing-yu2, GU Tao1, LV Shuai-shuai1
1. School of Mechanical Engineering, Nantong University, Nantong 226019, China; 2. Leading Electronic Materials Science and Technology Co., Ltd., Nantong 226500, China
Abstract: This paper mainly introduces the key technologies of powder preparation,molding process and sintering process of high thermal conductivity aluminum nitride (AIN) ceramic substrate.Some problems encountered in the development process are pointed out.Finally,summary and prospect of the key technologies of AIN ceramic substrate are given.
倪红军, 倪威, 马立斌, 何竟宇, 顾涛, 吕帅帅. 高导热AlN陶瓷基片制备技术研究现状及发展趋势[J]. 现代化工, 2017, 37(7): 45-48,50.
NI Hong-jun, NI Wei, MA Li-bin, HE Jing-yu, GU Tao, LV Shuai-shuai. Research status and development trend of preparation technologies for high thermal conductivity AlN ceramic substrates. Modern Chemical Industry, 2017, 37(7): 45-48,50.
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